JPH042028Y2 - - Google Patents
Info
- Publication number
- JPH042028Y2 JPH042028Y2 JP1985158212U JP15821285U JPH042028Y2 JP H042028 Y2 JPH042028 Y2 JP H042028Y2 JP 1985158212 U JP1985158212 U JP 1985158212U JP 15821285 U JP15821285 U JP 15821285U JP H042028 Y2 JPH042028 Y2 JP H042028Y2
- Authority
- JP
- Japan
- Prior art keywords
- protruding
- plate
- cavity
- pin
- protruding pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985158212U JPH042028Y2 (en]) | 1985-10-16 | 1985-10-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985158212U JPH042028Y2 (en]) | 1985-10-16 | 1985-10-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6265217U JPS6265217U (en]) | 1987-04-23 |
JPH042028Y2 true JPH042028Y2 (en]) | 1992-01-23 |
Family
ID=31081489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985158212U Expired JPH042028Y2 (en]) | 1985-10-16 | 1985-10-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH042028Y2 (en]) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5624227U (en]) * | 1979-07-31 | 1981-03-05 | ||
JPS58175916U (ja) * | 1982-05-18 | 1983-11-25 | 三洋電機株式会社 | 金型用エジエクタ−ビン |
-
1985
- 1985-10-16 JP JP1985158212U patent/JPH042028Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6265217U (en]) | 1987-04-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4332537A (en) | Encapsulation mold with removable cavity plates | |
JPH042028Y2 (en]) | ||
JP3035781B2 (ja) | ケース成形用金型装置 | |
JPH043768Y2 (en]) | ||
JP2807042B2 (ja) | リードフレームのモールド装置 | |
JPH0736729Y2 (ja) | カセット式の樹脂成形用金型 | |
JPS6294312A (ja) | モ−ルド金型 | |
JP2536546Y2 (ja) | インターデンタルブラシ成形用金型装置 | |
JPH0582801B2 (en]) | ||
JPH0356348Y2 (en]) | ||
JPS627456Y2 (en]) | ||
JPH06254911A (ja) | 射出成形用金型 | |
JPH036410Y2 (en]) | ||
JPS6341337U (en]) | ||
JPH0642336Y2 (ja) | 半導体素子の樹脂封止装置 | |
JPH0443293Y2 (en]) | ||
JPS627453Y2 (en]) | ||
JPH0711943Y2 (ja) | 成形用金型のロック機構 | |
JP2577908Y2 (ja) | 成形型 | |
JPH043776Y2 (en]) | ||
JPH11297732A (ja) | Icタグの製造方法 | |
JPS6152942A (ja) | プレス装置の安全装置 | |
JP2519967B2 (ja) | 成形金型 | |
JPH0533007Y2 (en]) | ||
JPS6356612U (en]) |